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Check out the video of the day: Future Advanced Packaging technologies and challenges Grace O' Malley, CTO at iNEMI discusses the latest updates on iNEMI Roadmaps. Grace also discusses many of challenges in advanced packaging design and assembly, including chiplet architecture and heterogeneous integration. Additionally, O'Malley discusses some of the upcoming technologies and studies, including photonics and optical performance. https://youtu.be/yVFqnDd1F_k | Global SMT & Packaging
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