Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

These days when we talk about what's next for chip design, we focus on things like cramming in more cores, increasing clock speeds, shrinking transistors and 3D stacking. We rarely think about the ...

Intel has announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the ...

Intel Corporation INTC is set to revolutionize the industry with the ground-breaking launch of glass substrates for advanced packaging of chips. This industry-leading product is likely to be available ...

To build more powerful processors, Intel plans on using glass instead of plastic for the base layer of the company’s computer chips. The change promises to help Intel pack even more “chiplets” and ...

Intel says that using glass substrates for chips instead of organic materials should allow for even more transistors to be packed into the same space, but we will have to wait a while for these chips.

Intel announced on September 18, 2023 that it has developed a glass core substrate for next-generation chip packaging. It is said that it will be able to provide chips with higher power efficiency and ...

Intel announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued ...